Transient electronic device with ion-exchanged glass treated interposer

摘要: A transient electronic device utilizes a glass-based interposer that is treated using ion-exchange processing to increase its fragility, and includes trigger operably mounted on surface thereof. An integrated circuit (IC) die then bonded the interposer, package structure where it serves, under normal operating conditions, connect IC I/O pins/balls. During event (e.g., when unauthorized tampering detected), signal transmitted device, causing generate an initial fracture force applied onto substrate. The configured such propagates through substrate with sufficient energy both entirely powderize transfer die, whereby also powderizes (i.e., visually disappears).