Capacitive pressure sensor and method

作者: Andrew B. Graham , Ando Feyh

DOI:

关键词: ElectrodeLayer (electronics)OptoelectronicsBase (geometry)OxideElectronic engineeringMaterials scienceWaferMicroelectromechanical systemsEtching (microfabrication)Capacitive pressure sensor

摘要: In one embodiment, a method of forming MEMS device includes providing silicon wafer with base layer and an intermediate above upper surface the layer. A first electrode is defined in oxide portion provided cap on second The further etching to form cavity such that when are projected onto layer, encompasses cavity.

参考文章(10)
Alexander E. Martens, Michael D. Potter, Electrostatic pressure transducer and a method thereof ,(2002)
Herman Coenraad Willem Beijerinck, Matthijs Suijlen, Jan Jacob Koning, MEMS pressure sensor ,(2010)
Gary Yama, Gary O'Brien, Andrew B. Graham, Out-of-plane spacer defined electrode ,(2012)
Richard L. Carley, Suresh Santhanam, Micromachined assembly with a multi-layer cap defining cavity ,(2004)
Gary Yama, Gary O'Brien, Andrew B. Graham, Wafer with spacer including horizontal member ,(2012)
J.L. Lund, C.V. Jahnes, H. Deligianni, L.P. Buchwalter, J.M. Cotte, P. Andricacos, D.E. Seeger, J.H. Magerlein, Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters 2002 Solid-State, Actuators, and Microsystems Workshop Technical Digest. ,(2002) , 10.31438/TRF.HH2002.10
Markus Lutz, Integrated pressure sensor ,(2000)
Robert G. Wodnicki, Rayette A. Fisher, Stanley Chienwu Cupertino Chu, Lowell Scott Smith, Wei-Cheng Tian, Ching-Yeu Wei, Hyon-Jin Fremont Kwon, David M. Mills, Kapazitive mikrobearbeitete Ultraschalltransducer und Verfahren zur Herstellung derselben ,(2007)