Selective metalization of electrical connector or socket housing
作者： James Rathburn
DOI:
关键词: Electrical connector 、 First contact 、 Electrical interconnect 、 Spring (mathematics) 、 Optoelectronics 、 Engineering 、 Structural engineering 、 Substrate (printing)
摘要: A electrical interconnect adapted to provide an interface between contact pads on IC device and a PCB. The includes multi-layered substrate with first surface plurality of openings having cross-sections, second center connecting the openings. include at least one cross-section greater than cross-sections. spring probe members are located in tips extending through opening above surface, portions shape bias toward PCB, respectively. dielectric material different from is opening, or opening.
google.com.au 参考文章(330)
Clayton W. Carpenter, Nader Shahriari, Test socket and system ,(2000)
Kyle K. Kirby, Charles M. Watkins, Compliant contact structure ,(2006)
Kent E. Regnier, Craig A. Bixler, David E. Dunham, John C. Laurx, Brian P. O'malley, High-density, robust connector ,(2006)
Warren M. Farnworth, Mike Brooks, Alan G. Wood, Stackable semiconductor package having conductive layer and insulating layers ,(2002)
Aaron R Garrity, Joseph C Morton, Paula Morrison, La Huerga Victoria De, Nutraceutical mangosteen tea ,(2004)
James Rathburn, Compliant printed circuit wafer probe diagnostic tool ,(2010)
James J. Rathburn, Multi-mode compliant connector and replaceable chip module utilizing the same ,(1998)
Junichi Ito, Kazuhiro Hayashi, Motohiko Sato, Manabu Sato, Jun Otsuka, Assembly of semiconductor device, interposer and substrate ,(2004)
Patrik Westerkull, Hearing-aid interconnection system ,(2005)
Michael C. Cilia, Gurpreet S. Dayal, Don Nguyen, BGA pin isolation and signal routing process ,(1998)