Solderless optical transceiver interconnect
作者： Mark Vodja Brillhart
DOI:
关键词: Resist 、 Electrical engineering 、 Printed circuit board 、 Optical fiber cable 、 Heat sink 、 Cable gland 、 Surface-mount technology 、 Transceiver 、 Land grid array 、 Engineering
摘要: A method and apparatus for assembly of a printed circuit board (PCB) having surface mount technology (SMT) components an optics device utilizes compressive connector to clamp the resist side loads. metallized particle interconnect or equivalent array interfaces land grid on with PCB. The passes through PCB hole in integrated heat sink device. pair devices may thus be mounted opposing sides tandem. Fiber optic cables attached so that they lead out parallel
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