作者: Charles Ingalz , Ken W. Chaney
DOI:
关键词: Chip 、 Integrated circuit packaging 、 Desoldering 、 Electrical engineering 、 Engineering 、 Integrated circuit 、 Diagnostic board 、 Pin compatibility 、 Small Outline Integrated Circuit 、 Printed circuit board
摘要: An apparatus for mounting an integrated circuit chip to a main printed board is disclosed. The particularly suitable situations in which cooling device of significant mass used cool the chip. In one embodiment, mounts onto daughter or sub-printed (PC) board, attaches chip, supports (as well as and sub-PC board) with support members, uses flexible conductors electrically connect board. another chip) connection means either case, inertial loads, those associated device, induced by impulse forces vibrations are shielded from damaging connections between A method also