Method and apparatus for mounting an integrated circuit to a printed circuit board

作者: Charles Ingalz , Ken W. Chaney

DOI:

关键词: ChipIntegrated circuit packagingDesolderingElectrical engineeringEngineeringIntegrated circuitDiagnostic boardPin compatibilitySmall Outline Integrated CircuitPrinted circuit board

摘要: An apparatus for mounting an integrated circuit chip to a main printed board is disclosed. The particularly suitable situations in which cooling device of significant mass used cool the chip. In one embodiment, mounts onto daughter or sub-printed (PC) board, attaches chip, supports (as well as and sub-PC board) with support members, uses flexible conductors electrically connect board. another chip) connection means either case, inertial loads, those associated device, induced by impulse forces vibrations are shielded from damaging connections between A method also

参考文章(5)
Douglas H. Strope, Thomas E. Wray, Peter A. Engel, Displacement compensating module ,(1984)
James Andrew Roecker, Angela Marie Torres, Wilbur Terry Layton, Blanquita Ortega Morange, Integrated circuit package having a liquid metal - aluminum/copper joint ,(1995)
Sanjeev Balwant Sathe, David James Alcoe, Electronic package with compressible heatsink structure ,(1997)
Yoshimasa Tanaka, Yuzo Shimada, Takayuki Suyama, Supporting member for cooling means and electronic package using the same ,(1995)