Effects of Grain Orientation on the Electromigration of Cu-Reinforced Composite Solder Joints
作者： Yan Wang , Jing Han , Fu Guo , Xiaoxing Ke
DOI: 10.1007/S11664-017-5585-7
关键词: Metallurgy 、 Grain orientation 、 Soldering 、 Electron flow 、 Materials science 、 Electromigration 、 Solid-state physics 、 Composite solder 、 Perpendicular 、 Composite number
摘要: Grain orientations are a significant factor under high-density current stressing, but there few literature reports about the influence of grain orientation on electromigration in composite solder joints. Most research relating to behavior solders have been carried out by adding different kinds reinforced particles order relieve phenomena, while impacts neglected. In this paper, Sn-3.5Ag joints 2 vol.% Cu were fabricated investigate effects Sn electromigration. The one-dimensional single-grained stressed constant density 104A/cm2 for times at room temperature. samples, which c-axis grains was nearly parallel electron flow direction, exhibited serious electromigration-induced phenomena after stressing 528 h. However, not observed samples where had their perpendicular direction. Therefore, great and atoms moved faster along than a- b-axes during stressing.
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sci-hub.se 参考文章(32)
S. Choi, J. P. Lucas, K. N. Subramanian, T. R. Bieler, Formation and growth of interfacial intermetallic layers in eutectic Sn-Ag solder and its composite solder joints Journal of Materials Science: Materials in Electronics. ,vol. 11, pp. 497- 502 ,(2000) , 10.1023/A:1008968518512
Hongtao Chen, Chunjin Hang, Xing Fu, Mingyu Li, Microstructure and Grain Orientation Evolution in Sn-3.0Ag-0.5Cu Solder Interconnects Under Electrical Current Stressing Journal of Electronic Materials. ,vol. 44, pp. 3880- 3887 ,(2015) , 10.1007/S11664-015-3922-2
Sinn-Wen Chen, Chih-Ming Chen, Chao-Hong Wang, Chia-Ming Hsu, Effects of Electromigration on Electronic Solder Joints John Wiley & Sons, Ltd. pp. 401- 422 ,(2012) , 10.1002/9781119966203.CH16
Zhongbao Yang, Wei Zhou, Ping Wu, Effects of Ni-coated Carbon Nanotubes addition on the electromigration of Sn–Ag–Cu solder joints Journal of Alloys and Compounds. ,vol. 581, pp. 202- 205 ,(2013) , 10.1016/J.JALLCOM.2013.07.058
B. Arfaei, N. Kim, E.J. Cotts, Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature Journal of Electronic Materials. ,vol. 41, pp. 362- 374 ,(2012) , 10.1007/S11664-011-1756-0
F. Tai, F. Guo, Z. D. Xia, Y. P. Lei, Y. W. Shi, Effects of nano-structured particles on microstructure and microhardness of Sn–Ag solder alloy Journal of Materials Science: Materials in Electronics. ,vol. 21, pp. 702- 707 ,(2010) , 10.1007/S10854-009-9981-5
Ruihong Zhang, Guangchen Xu, Xitao Wang, Fu Guo, Andre Lee, K. N. Subramanian, Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane Journal of Electronic Materials. ,vol. 39, pp. 2513- 2521 ,(2010) , 10.1007/S11664-010-1377-Z
Youngseok Kim, Shijo Nagao, Tohru Sugahara, Katsuaki Suganuma, Minoru Ueshima, Hans-Juergen Albrecht, Klaus Wilke, Joerg Strogies, Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current Journal of Electronic Materials. ,vol. 43, pp. 4428- 4434 ,(2014) , 10.1007/S11664-014-3377-X
K. N. Subramanian, T. R. Bieler, J. P. Lucas, Microstructural engineering of solders Journal of Electronic Materials. ,vol. 28, pp. 1176- 1183 ,(1999) , 10.1007/S11664-999-0154-3
Jun Shen, Qin Tang, Yayun Pu, Dajun Zhai, Zhongming Cao, Jie Chen, Influence of POSS nano-particles on Sn–3.0Ag–0.5Cu–xPOSS/Cu composite solder joints during isothermal aging Journal of Materials Science: Materials in Electronics. ,vol. 24, pp. 4881- 4887 ,(2013) , 10.1007/S10854-013-1492-8