Die bonding apparatus
作者： Hiroaki Kobayashi
DOI:
关键词: Die (integrated circuit) 、 Die bonding 、 Linear motor 、 Semiconductor 、 Position sensor 、 Structural engineering 、 Lead frame 、 Mechanical engineering 、 Collet 、 Pressure sensitive 、 Engineering
摘要: A die bonding apparatus for a semiconductor onto boding surface of lead frame by pressing the under constant pressure. The includes mounting section collet having chucking portion holding mounted on section, linear motor moving up and down, separating member from horizontal driving horizontally, frame, position sensor detecting vertical positions control controlling travel speed pressure against controllably basis information detected sensor.
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