作者: Stefan Lindekugel , Regina Pavlovic , Stefan Reber
DOI:
关键词: Solar cell 、 Semiconductor structure 、 Substrate (printing) 、 Layer (electronics) 、 Adhesion 、 Semiconductor 、 Nanotechnology 、 Materials science
摘要: The invention relates to a semiconductor structure that consists of substrate and layer which are materially bonded together via thermally and/or chemically curable adhesion promoter. further method for producing such connections. also the use structures, in particular solar cells or cell modules.