Electronic package structure
作者： Da-Jung Chen , Chun-Tiao Liu , Bau-Ru Lu
DOI:
关键词: Encapsulation (networking) 、 Electrode 、 Electronic packages 、 Electrical conductor 、 Electronic engineering 、 Optoelectronics 、 Engineering
摘要: The present invention discloses an electronic package structure. body has a top surface with cavity thereon, the first conductive element is disposed in cavity, and second body. external electrode electrically connected to are both on of or formed by encapsulation compound exposed portions which not covered compound.
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