Device Including Two Power Semiconductor Chips and Manufacturing Thereof
作者： Josef Hoeglauer , Joachim Mahler , Johannes Lodermeyer , Ralf Otremba
DOI:
关键词: Power (physics) 、 Semiconductor 、 First contact 、 Contact pad 、 Semiconductor chip 、 Engineering 、 Electrical engineering
摘要: A device includes a first power semiconductor chip with contact pad and second on face third the face. The further chips are arranged one above another, of faces in direction chip. In addition, is located laterally at least partially outside outline
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