Embedded Solid-State Cooling Layer Configurations in Power Electronics

摘要: The use of embedded solid-state cooling inserts to increase the power densities in electronic modules seems promising. Numerical simulations have been used evaluate performance layers into volumes with low thermal conductivity. impact interfacial resistance on such schemes was determined. Typical values were obtained experimentally. Experimental verification numerically increases layer done. An 167% allowed effective heat generation density achieved an initial electronics test case using aluminium nitride reduce peak temperatures ferrite. Functional and optimisation performed terms geometric dimensions. Miniaturisation will improve thermal-magnetic only if are sufficiently small.