Vertical transmon qubit device
作者： Rasit Onur Topaloglu , Sami Rosenblatt , Markus Brink
DOI:
关键词: Capacitor 、 Optoelectronics 、 Chip 、 Substrate (printing) 、 Superconducting material 、 Qubit 、 Josephson effect 、 Base (geometry) 、 Transmon 、 Materials science
摘要: Techniques for a vertical transmon qubit device are provided. In one embodiment, chip surface base structure is provided that comprises first superconducting material physically coupled to crystalline substrate, wherein the substrate second material, substrate. implementation, also Josephson junction located in via of comprising tunnel barrier, and material. capacitor formed between
lens.org 参考文章(41)
John Vivalda, Richard Hunt, Alexander F. Kirichenko, Daniel Yohannes, Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit ,(2014)
Stephanie Moyerman, Brian Keating, Tunnel junction fabrication ,(2014)
Alexander Ya. Tzalenchuk, Jeremy P. Hilton, Alexandre M. Zagoskin, Superconducting low inductance qubit ,(2002)
Bishnu Prasanna Gogoi, Semiconductor structure and method of manufacture ,(2008)
Gerard J. Milburn, Alexander Rudolf Hamilton, Lloyd Christopher Leonard Hollenberg, Andrew Steven Dzurak, Cameron Wellard, Robert Graham Clark, David J. Reilly, Solid state charge qubit device ,(2003)
David W. Abraham, Christian Lavoie, George A. Keefe, Mary E. Rothwell, Chip mode isolation and cross-talk reduction through buried metal layers and through-vias ,(2013)
Alfred Prof. Dr. Zehe, Josephson junction array device, and manufacture thereof ,(1997)
Sergey K. Tolpygo, Double-masking technique for increasing fabrication yield in superconducting electronics ,(2006)
Theodore Van Duzer, Xiaoxan Meng, Anupama Bhat Kaul, Lei Yu, Nathan Newman, Internally shunted Josephson junction device ,(2002)
Alfred Euinam Lee, Gregory Steven Lee, Randy Wayne Simon, Christine Elizabeth Platt, High-frequency substrate material for thin-film layered perovskite superconductors ,(1989)