Thermoformable multilayer barrier structures
作者： Theodore C. Wallace , Bernie A. Kozakiewicz
DOI:
关键词: Transmission properties 、 Composite material 、 Materials science 、 Scrap 、 Rigidity (electromagnetism) 、 Toughness
摘要: A multilayer thermoformable packaging material is provided and includes one layer of barrier containing a resin having low gas vapor transmission properties. The structure also which utilizes scrap produced from the structure. Other optional layers may be included in to provide additional features such as rigidity toughness.
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