High ductility of a metal film adherent on a polymer substrate
作者： Yong Xiang , Teng Li , Zhigang Suo , Joost J. Vlassak
DOI: 10.1063/1.2108110
关键词: Thin film 、 Composite material 、 Polymer substrate 、 Metal 、 Polymer 、 Adhesion 、 Ultimate tensile strength 、 Ductility 、 Intergranular fracture 、 Materials science
摘要: In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on …
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