作者: Mario Gonzalez , Fabrice Axisa , Frederick Bossuyt , Yung‐Yu Hsu , Bart Vandevelde
DOI: 10.1108/03056120910928699
关键词: Materials science 、 Interconnection 、 Copper interconnect 、 Finite element method 、 Physical behaviour 、 Electronic circuit 、 Combined use 、 Ultimate tensile strength 、 Electrical conductor 、 Structural engineering
摘要: Purpose – The purpose of this paper is to present an update on the progress design and reliability stretchable interconnections for electronic circuits.Design/methodology/approach Finite element modelling (FEM) used analyse physical behaviour interconnects under different loading conditions. fatigue life a copper interconnect embedded into silicone matrix has been evaluated using Coffin‐Manson relation FEM.Findings mechanical properties substrate metal interconnection play important role lifetime circuit. In case PDMS Sylgard 186, more than 2,500 tensile cycles have observed periodic deformation 10 per cent.Research limitations/implications Reliability results are limited need further work create accurate empirical model estimate interconnections.Originality/value combined use FEM experimental a...