High heat flux spray cooling of electronics
作者： Maninder S. Sehmbey , Louis C. Chow , Martin R. Pais , Tom Mahefkey
DOI: 10.1063/1.47084
关键词: Microelectronics 、 Electronics 、 Heat flux 、 Nucleate boiling 、 Flux 、 Mechanical engineering 、 High heat 、 Critical heat flux 、 Materials science 、 Spray cooling
摘要: A significant amount of attention has been focussed on methods high heat flux removal due to the advancing requirements electronics industry. Spray cooling is one best candidates for these applications. This paper presents a discussion spray The research reviewed along with its implications. Available empirical correlations are also assessed brief comparison capabilities other techniques.
scitation.org
harvard.edu
aip.org
sci-hub.se 参考文章(10)
M. S. Sehmbey, M. R. Pais, L. C. Chow, Effect of surface material properties and surface characteristics in evaporative spray cooling Journal of Thermophysics and Heat Transfer. ,vol. 6, pp. 505- 512 ,(1990) , 10.2514/3.389
S.C. Yao, K.J. Choit, Heat transfer experiments of mono-dispersed vertically impacting sprays International Journal of Multiphase Flow. ,vol. 13, pp. 639- 648 ,(1987) , 10.1016/0301-9322(87)90041-3
J. YANG, L. CHOW, M. PAIS, A correlation for critical heat flux in droplet impingement cooling AIAA, 28th Thermophysics Conference. ,(1993) , 10.2514/6.1993-2850
M. Ghodbane, J.P. Holman, Experimental study of spray cooling with Freon-113 International Journal of Heat and Mass Transfer. ,vol. 34, pp. 1163- 1174 ,(1991) , 10.1016/0017-9310(91)90025-A
R.G. Waters, Diode laser degradation mechanisms: A review Progress in Quantum Electronics. ,vol. 15, pp. 153- 174 ,(1991) , 10.1016/0079-6727(91)90004-2
Maninder S. Sehmbey, Louis C. Chow, Ottfried J. Hahn, Martin R. Pais, Effect of spray characteristics on spray cooling with liquid nitrogen Journal of Thermophysics and Heat Transfer. ,vol. 9, pp. 757- 765 ,(1994) , 10.2514/3.735
Jidong Yang, Martin R. Pais, Louis C. Chow, Critical Heat Flux Limits in Secondary Gas Atomized Liquid Spray Cooling Experimental Heat Transfer. ,vol. 6, pp. 55- 67 ,(1993) , 10.1080/08916159208945369
M. R. Pais, L. C. Chow, E. T. Mahefkey, Surface Roughness and Its Effects on the Heat Transfer Mechanism in Spray Cooling Journal of Heat Transfer-transactions of The Asme. ,vol. 114, pp. 211- 219 ,(1992) , 10.1115/1.2911248
J. Yang, L. C. Chow, M. R. Pais, Nucleate Boiling Heat Transfer in Spray Cooling Journal of Heat Transfer. ,vol. 118, pp. 668- 671 ,(1996) , 10.1115/1.2822684
C.C. Lee, D.H. Chien, Thermal and package design of high power laser diodes semiconductor thermal measurement and management symposium. pp. 75- 80 ,(1993) , 10.1109/STHERM.1993.225329