Advanced interconnection technologies for flexible organic electronic systems
作者： E. Lorenz , A. Zimmermann , M. Koyuncu
DOI: 10.1016/B978-1-78242-035-4.00006-3
关键词: Functional diversity 、 High potential 、 Rendering (computer graphics) 、 Electronic hardware 、 Interconnection 、 Flexible electronics 、 Electronics 、 Electronic systems 、 Electronic engineering 、 Engineering
摘要: Flexible electronics offers high potential for innovative products by rendering electronic hardware compatible with nonplanar surfaces. Foil-based electronics, e.g. System-in-Foil, paved the way to flexible providing a level of packaging density as well means integrate functional diversity into single package. Components substantially different geometrical and mechanical properties can be integrated form provided integration technologies process flow are designed. Component brings heterogeneous techniques foreground, requiring detailed consideration processes materials that will provide electrical between components foils. This paper provides survey various approaches latest developments, possible validation methodologies systems.
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