Polymer UV-molding for micro-optical systems and O/E-integration

摘要: The potential and limits of micromoulding technology for the wafer scale hybrid integration micro-optic elements on top arbitrary substrates like glass, Silicon, III/V-semiconductors by a process which is performed in modified contact mask aligner. are characterised high precision stability, temperature stable precise pitch, index, homogeneity, uniformity across wafer, they fulfill additional requirements practical application (AR-coating, separation dicing saw). Additionally, two- sided replication has been developed. lens arrays fabricated reflow UV-moulding investigated, performance these collimation fiber shown. Steps toward with vertical cavity surface emitting lasers (VCSELs) locally selective demonstrated.