作者: H.J. Chao , T.J. Robe , L.S. Smoot
DOI: 10.1109/4.269
关键词: Chip 、 Access network 、 Broadband networks 、 Chip carrier 、 CMOS 、 Multiplexing 、 Integrated Services Digital Network 、 Computer hardware 、 Electronic engineering 、 Interfacing 、 Engineering
摘要: A LSI framer chip, which provides a SONET-like time-division-multiplexed frame structure and has been implemented in production 2- mu m CMOS technology, is described. Current samples of the chip have tested functional to 160 Mb/s. The primary attributes presented include circuit features used achieve high-bit-rate operation, level translation circuits afford direct interfacing ECL clock data signals, capabilities lead broad application communications networks. Several examples its use prototype broadband local access network are also ship operates from single 5-V supply, dissipates approximately 420 mW, packaged 68-pin leadless ceramic carrier (LCCC) package. >