Preliminary Study of the Effect of Stirring Rate, Temperature and Oxygen Pressure on the Leach Rate of Copper Powder, Generated by Grinding of Printed Circuit Boards of Computer

摘要: For this study, a sample of 5 g copper powders obtained by grinding printed circuit boards computers fixe to 50 mesh (270 μm) according Tyler® series was used. This wholly characterized XRD, SEM–EDS and AAS. The leaching medium used \( {\text{O}}_{ 2}{-}{{{\text{S}}_{ 2} 3}}^{{ 2{-}}}} \). From the evaluated variables it an apparent order reaction n = 2.34 s−1, whereas effect partial oxygen pressure 0.9516 activation energy system 6.5 kJ mol−1, results so achieved suggest transport control solid–liquid interface. Under certain work conditions such as: {{\text{S}_{2}\text{O}_{3}}^{2-}}= 0.5\,\text{M} \), 500 mL, 750 min−1, P/PO2 1 atm, 338 K, 9000 s time, is possible get up 97.35% leached copper.