Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of 99Sn-1Cu/Cu Solder Interconnects
作者： Zhiwen Chen , Changqing Liu , Yiping Wu , Bing An
DOI: 10.1007/S11664-015-4043-7
关键词: Soldering 、 Growth rate 、 Planar 、 Diffusion 、 Free surface 、 Metallurgy 、 Solid-state physics 、 Composite material 、 Intermetallic 、 Perpendicular 、 Materials science
摘要: The growth of intermetallic compounds (IMCs) on the free surface 99Sn-1Cu solder joints perpendicular to interdiffusion direction has been investigated in this work. specimens were specifically designed and polished reveal a flat at solder/Cu interface for investigation. After aging 175°C progressively increased durations, height IMCs was examined found follow parabolic law with duration that could be expressed as \(y = 0.11\sqrt t\), where t is hours y μm. For comparison, planar along also 99Sn-1Cu/Cu joints. prolonged 175°C, thickness interfacial IMC layers parabolically \(h_{\rm{IMC}} 0.27\sqrt + 4.6\), h μm time hours. It both diffusion-controlled processes, but much slower than their due longer diffusion distance. proposed Cu3Sn forms prior formation Cu6Sn5 IMCs, being reverse order compared growth.
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