Method of manufacturing a structural frame
作者： Kevin A. McCullough
DOI:
关键词: Thermal 、 Shield 、 Mechanical engineering 、 Structural engineering 、 Structural system 、 Electromagnetic interference 、 Electronic circuit 、 Electrical conductor 、 Frame (networking) 、 Engineering 、 Electronic component
摘要: A structural frame ( 12 ) for dissipating heat from an electronic device 10 is provided. The ), to which circuit board 14 containing a generating component 16 mounted, injection molded thermally conductive, net-shape moldable polymer composition. that within the in thermal communication with so generated transferred and dissipated heat-generating ). An outer case 22 may be mounted finish or serve as all part of well. In addition, has characteristics engineered used shield electromagnetic interference.
lens.org 参考文章(27)
Hitoshi Masuda, Plastic shield enclosure and method of producing the same ,(1995)
Tommie Hayward, Injection molding graphite material and thermoplastic material ,(1996)
Rafael E. Aguilera, Passive CPU cooling and LCD heating for a laptop computer ,(1995)
Rafael E. Aguilera, Honeycomb celled-sheet layer composite panel for monitoring an LCD to a laptop computer ,(1995)
Kevin Haley, Hong Xie, Mostafa Aghazadeh, Apparatus for dissipating heat in a hinged computing device ,(1996)
Joseph P. Tomase, David J. Anderson, Roy E. Hunninghaus, Kevin M. Andrews, Gary L. Christopher, Solder bonded electronic module ,(1997)
David E. Wilson, Arthur Holmberg, Low torque hinged heat transfer joint ,(1990)
Gregory Turturro, Hong Xie, Chia-Pin Chiu, Mostafa Aghazadeh, Dissipation of heat through keyboard using a heat pipe ,(1994)
Eugene Novin, David A. Lowry, Rotatable heat transfer coupling ,(1998)
Scott L. Noble, Daryl J. Nelson, Collapsible cooling apparatus for portable computer ,(1994)