METHOD AND APPARATUS FOR CHECKING AND MEASURING NEEDLE CARD ADAPTERS
作者： Kunz Martin , Lobeda Ronny
DOI:
关键词: Electrical network 、 Clamping 、 Electrical engineering 、 Wafer 、 Electrical contacts 、 Adapter (computing) 、 Printed circuit board 、 State (computer science) 、 Materials science 、 Head (vessel)
摘要: The invention relates to a method for checking and measuring needle card adapters mechanical electrical functionality, wherein the adapter consists at least of printed circuit board having one structure probe head fastening needles board, are electrically connected tips said used make contact with areas on wafers be tested, which is characterized in that clamped apparatus such manner any unevenness eliminated by means pressure clamping state reproducible achieved, corresponds wafer prober during testing, surface faces as measurement reference plane state.
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