Method of selectively removing a region formed of silicon oxide and plasma processing apparatus

作者: Akinori Kitamura , Hiroto Ohtake , Eiji Suzuki

DOI:

关键词: Sequence (biology)Analytical chemistrySilicon oxideSiliconChemistryStructural engineeringPlasma processingHydrogenContainer (type theory)

摘要: Provided is a method of selectively removing first region from workpiece which includes the formed silicon oxide and second silicon. The performs plurality sequences. Each sequence includes: forming denatured by generating plasma processing gas that contains hydrogen, nitrogen, fluorine within container accommodates so as to denature portion region, container. In addition, subsequent predetermined number sequences after among further exposing reducing generated container, prior region.

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