Forming electromagnetic communication circuit components using densified metal powder

作者: David W. Kuhns , David C. Koskenmaki

DOI:

关键词: Thermal conductionMaterials scienceElectronic surveillanceLayer (electronics)Metal powderSubstrate (printing)Electronic componentCapacitorComposite materialHydraulic press

摘要: Manufacturing techniques are described for forming electrical components. For example, a layer of metal powder composition is deposited onto at least portion substrate. Pressure applied to the by hydraulic press that has one or more projections in order capture pattern on The compressed adhere substrate form captured pattern. regions not do and may be removed. components, such as antennae, capacitor plates, conduction pads like, use an electronic surveillance system (EAS), radio frequency identification (RFID) system, like.

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