SOLID-STATE IMAGE SENSOR

摘要: PURPOSE:To prevent post-packaging accidents caused by deposits of dust making the top surface an insulating film agree with, or project out of, that a photoshield on photodetector. CONSTITUTION:A semiconductor substrate 1 incorporates photodetector 2 in region and is overlaid with 5 via 3. In this case 3 made to 5. This design prevents from entering into recess stagnating there; therefore, decrease drastically.