THz metal mesh filters on electrically thick fused silica substrates

作者: W. J. Otter , F. Hu , J. Hazell , S. Lucyszyn

DOI: 10.1109/IRMMW-THZ.2014.6956406

关键词: Substrate (electronics)ExcitationTerahertz radiationOptical filterSurface micromachiningOptoelectronicsBand-pass filterMaterials scienceMetal mesh

摘要: This paper shows simulated and measured results of ultra-low cost metal mesh filters on electrically thick substrates for millimeter-wave THz bands. It provides a broad overview currently available suggest why it is worth moving to an substrate applications. We demonstrate scalable traditional 525 µm fused silica substrates. In addition, trapped-mode excitation exploited improve out-of-band rejection at higher frequencies. The prove that these are in the range using cost-effective micromachining manufacturing. work opens up possibility

参考文章(5)
Stepan Lucyszyn, Fangjing Hu, William J. Otter, Technology demonstrators for low-cost terahertz engineering 2013 Asia-Pacific Microwave Conference Proceedings (APMC). pp. 518- 520 ,(2013) , 10.1109/APMC.2013.6694850
Fabio Pavanello, Frédéric Garet, Mohan-Babu Kuppam, Emilien Peytavit, Mathias Vanwolleghem, François Vaurette, Jean-Louis Coutaz, Jean-François Lampin, Broadband ultra-low-loss mesh filters on flexible cyclic olefin copolymer films for terahertz applications Applied Physics Letters. ,vol. 102, pp. 111114- ,(2013) , 10.1063/1.4798522
Oliver Paul, René Beigang, Marco Rahm, Highly Selective Terahertz Bandpass Filters Based on Trapped Mode Excitation Optics Express. ,vol. 17, pp. 18590- 18595 ,(2009) , 10.1364/OE.17.018590
Yi Wang, Bin Yang, Yingtao Tian, Robert S. Donnan, Michael J. Lancaster, Micromachined Thick Mesh Filters for Millimeter-Wave and Terahertz Applications IEEE Transactions on Terahertz Science and Technology. ,vol. 4, pp. 247- 253 ,(2014) , 10.1109/TTHZ.2013.2296564
Arline M. Melo, Angelo L. Gobbi, Maria H. O. Piazzetta, Alexandre M. P. A. da Silva, Cross-Shaped Terahertz Metal Mesh Filters: Historical Review and Results Advances in Optical Technologies. ,vol. 2012, pp. 1- 12 ,(2012) , 10.1155/2012/530512