作者: W. J. Otter , F. Hu , J. Hazell , S. Lucyszyn
DOI: 10.1109/IRMMW-THZ.2014.6956406
关键词: Substrate (electronics) 、 Excitation 、 Terahertz radiation 、 Optical filter 、 Surface micromachining 、 Optoelectronics 、 Band-pass filter 、 Materials science 、 Metal mesh
摘要: This paper shows simulated and measured results of ultra-low cost metal mesh filters on electrically thick substrates for millimeter-wave THz bands. It provides a broad overview currently available suggest why it is worth moving to an substrate applications. We demonstrate scalable traditional 525 µm fused silica substrates. In addition, trapped-mode excitation exploited improve out-of-band rejection at higher frequencies. The prove that these are in the range using cost-effective micromachining manufacturing. work opens up possibility