Stacked die assembly having semiconductor die projecting beyond support
作者： Roger D. St. Amand , Vladimir Perelman
DOI:
关键词: Stack (abstract data type) 、 Die (integrated circuit) 、 Active surface 、 Materials science 、 Semiconductor 、 Structural engineering 、 Optoelectronics 、 Substrate surface
摘要: A stack of semiconductor dies is disclosed. first level includes a die and at least one support that are attached to substrate surface. second the active surface coplanar support(s). third The do not overlap bond pads dies, respectively. An adhesive film overlies entire inactive attaches immediately underlying
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