Metallic pastes and inks
作者： Mohshi Yang , Zvi Yaniv , David Max Roundhill
DOI:
关键词: Curing (chemistry) 、 Solvent 、 Composite material 、 Metallurgy 、 Electrical resistivity and conductivity 、 Metal nanoparticles 、 Conductor 、 Metal 、 Materials science
摘要: A metallic composition including a solvent and plurality of metal nanoparticles dispersed therein is formulated such that curing the on substrate provides conductor with resistivity about 5×10 −4 Ω·cm or less. Electrical components an assembly can be interconnected by formed substrate. deposited solidified. The contacted wire before after solidification secured to solidified composition.
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