Electronic device incorporating a randomized interconnection layer having a randomized conduction pattern
作者： Viet Hoang Nguyen , Michael Antoine Armand In't Zandt
DOI:
关键词: Electrical engineering 、 Interconnection 、 Materials science 、 Optoelectronics 、 Substrate (printing) 、 Silicon 、 Coupling (electronics) 、 Electrode 、 Electrical conductor 、 Layer (electronics) 、 Etching (microfabrication)
摘要: An electronic device incorporating a randomized interconnection layer. In one example, the includes layer having conductive pattern formed by etching of heterogeneous layer; and sensing circuit, electrically coupled to detect pattern. another method fabricating forming set electrodes proximate silicon substrate; depositing elements onto form pattern; coupling circuit
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