作者: James Hammond Brannon
DOI:
关键词: Penetration depth 、 Chamfer 、 Laser 、 Irradiation 、 Surface tension 、 Edge (geometry) 、 Polishing 、 Materials science 、 Optics 、 Abrasive
摘要: A carbon dioxide laser is used as a non-mechanical means for smoothing and polishing the as-cut chamfer surface at edge of disk. Applying radiation to glass causes transient melting resolidification. Due tension effects, resolidifies produce that significantly smoother than it was before irradiation. If scratches or abrasive marks are present on prior irradiation, irradiation process “polishes out” these defects long they not too deep. At wavelength near 10 μm, penetration depth into approximately 1 μm. Therefore, this order magnitude eliminated. The quality resulting modified far superior original mechanically ground polished surface.