Pad structures to improve board-level reliability of solder-on-pad BGA structures
作者： Yuan Li
DOI:
关键词: Layer (electronics) 、 Structural engineering 、 Reliability (semiconductor) 、 Ball grid array 、 Engineering 、 Edge (geometry) 、 Crack initiation 、 Solder paste 、 Soldering 、 Composite material
摘要: The present invention is directed to a new bonding pad structure having rugged contact interface that makes it more difficult for crack grow from the peripheral edge of pad. also helps accumulate solder paste on pad, increase thickness layer near and prevent being oxidized turning into initiation point.
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