Integrated circuit package having surface-mount blocking elements

摘要: A first cavity-down ball grid array (BGA) package includes a substrate member and an of bond balls. The balls pair parallel extending rows outer mesh row inner signal that is to the surface-mount blocking element disposed between either passive or active component BGA package. In one example, surface-mounted second form package-on-package (POP) security module. provides additional physical barrier against probing Sensitive data therefore protected from unauthorized access.