Low cte interposer without tsv structure
作者： Cyprian Emeka Uzoh , Michael Newman , Charles G. Woychik , Terrence Caskey
DOI:
关键词: Electrically conductive 、 Electronic engineering 、 Dielectric 、 Thermal expansion 、 Microelectronics 、 Materials science 、 Interposer 、 Composite material
摘要: A microelectronic assembly including a dielectric region, plurality of electrically conductive elements, an encapsulant, and element are provided. The encapsulant may have coefficient thermal expansion (CTE) no greater than twice CTE associated with at least one the region or element.
google.de 参考文章(31)
Ade'yemi S. K. Harding, Preformed packaging arrangement for energy dissipating devices ,(1987)
Craig Mitchell, Thomas H. DiStefano, System for encapsulating microelectronic devices ,(1998)
Yu Gu, Wei Meng, Chee Siang Ong, Yaojian Lin, Kang Chen, Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers ,(2011)
Ilyas Mohammed, Belgacem Haba, Interposer having molded low cte dielectric ,(2012)
Tan Nguyen, Craig S. Mitchell, Thomas H. DiStefano, Encapsulation of microelectronic assemblies ,(2001)
Masahiro Sunohara, Interposer mounted wiring board and electronic component device ,(2010)
Stephen S. Drofitz, Jeffrey T. Coffin, Lewis S. Goldmann, Mario J. Interrante, Raed A. Sherif, Kevin G. Bivona, Sushumna Iruvanti, Hermetic CBGA/CCGA structure with thermal paste cooling ,(1997)
Ming-Da Cheng, Chen-Hua Yu, Chung-Shi Liu, Mirng-Ji Lii, Package-On-Package (PoP) Structure and Method ,(2012)
Sergey Savastiouk, Sam Kao, Patrick B. Halahan, Packaging substrates for integrated circuits and soldering methods ,(2004)
Masud Beroz, Bob Wen Zhong Kong, Michael Warner, Methods of making microelectronic packages including electrically and/or thermally conductive element ,(2003)