Insert Molded Device Housings for Portable Electronic Devices
作者： Pinida Jan Moolsintong , Stephen Paul Zadesky , Tang Tew Tan , Daniel W. Jarvis
DOI:
关键词: Molding (decorative) 、 Electronics 、 Substrate (printing) 、 Optoelectronics 、 Insert (composites) 、 Engineering 、 Structural engineering 、 Layer (electronics)
摘要: Improved techniques for forming an electronic device housing in which outer member can be assembled with one or more other members of the are disclosed. The together a thin substrate layer (or substrate) form frame to secured. facilitates molding adjacent member. In embodiment, made glass and polymer, such as plastic. can, example, formed polymer metal. resulting yet sufficiently strong suitable use devices, portable devices.
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