System having stackable heat sink structures
作者： Joseph H. Joroski , Mark R. Schneider , Michael D. Rostoker
DOI:
关键词: Interference fit 、 Layer (electronics) 、 Composite material 、 Heat sink 、 Fin (extended surface) 、 Electronic systems 、 Projection (mathematics) 、 Effective size 、 Integrated circuit 、 Structural engineering 、 Materials science
摘要: Electronic systems utilizing a plurality of integrated circuit packages having stackable heat sink assembly is formed by press-fit two or more identical fin layers. Each layer using powdered metallurgy and has button-like projection extending from its bottom surface recess opening in top surface. The are sized shaped such that an interference fit when the buttonlike one pressed into another layer. use adaptor to increase decrease effective size bottom-most described. Relieving gases may be entrapped during Circular, elliptical polygonal shapes (outlines) for layers
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