Effect of copper lamination on the rheological and copper adhesion properties of a thermotropic liquid crystalline polymer used in PCB applications
作者： C.G.L. Khoo , B. Brox , R. Norrhede , F.H.J. Maurer
DOI: 10.1109/3476.649445
关键词: Printed circuit board 、 Copper 、 Modulus 、 Thermotropic crystal 、 Recrystallization (metallurgy) 、 Polymer 、 Shear modulus 、 Lamination (geology) 、 Composite material 、 Materials science
摘要: Attempts were made to improve the adhesion and strength properties of a copper clad thermotropic liquid crystalline polymer (LCP) for use in advanced printed circuit board (PCB) applications, through manipulation processing/laminating conditions. Two types foil investigated. Most significantly, it was observed during these trials that presence itself laminated sample dampens modulus growth rate LCP recrystallization process, which occurs lamination cycle. The amount this dampening occurred appeared depend both on concentration higher melting crystals already present as well type used lamination. This observation has not been previously reported is expected influence calculations relating construction PCB applications using LCPs substrate material.
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