Thermoelectric package design for high ambient temperature electronics cooling

摘要: With the emergence of wide bandgap power devices, there is now ability to reduce size and weight converters through use high frequency switching temperature (high-T) operation. Due lack maturity signal electronics, it can be cost effective utilize low-temperature rated components in high-T conditions. Active heat pumping potentially maintain a safe, low electronic components. In this paper, thermally-insulated electronics package has been designed tested for thermal management environments. Solid-state thermoelectric exploited device while operating ambient temperatures higher than 20°C over device. A physics-based model developed optimization which couples sink performance. The fabricated at various conditions where an excellent agreement with predictions noted. advantages drawbacks employing such applications are discussed.