Thick film laser induced forward transfer for deposition of thermally and mechanically sensitive materials

作者: Nicholas T. Kattamis , Priscilla E. Purnick , Ron Weiss , Craig B. Arnold

DOI: 10.1063/1.2799877

关键词: Thin filmLayer (electronics)Shock (mechanics)Materials scienceThermal shockOptoelectronicsLaserPolymerNanotechnologyDeformation (engineering)Deposition (phase transition)

摘要: Laser forward transfer processes incorporating thin absorbing films can be used to deposit robust organic and inorganic materials but the deposition of more delicate has remained elusive due contamination stress induced during process. Here, we present approach high resolution patterning sensitive by a thick film polymer layer that is able dissipate shock energy through mechanical deformation. Multiple mechanisms for as function incident laser are observed show viable contamination-free living mammalian embryonic stem cells.

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