Various structure/height bumps for wafer level-chip scale package
作者： Han Shen Ch'ng , Eng Han Matthew Lim
DOI:
关键词: Substrate (building) 、 Chip-scale package 、 Die (integrated circuit) 、 Epoxy 、 Wafer 、 Materials science 、 Soldering 、 Composite material 、 Layer (electronics)
摘要: A die comprising: a substrate; two or more various shaped bump structures having solder line formed over the and an epoxy layer substrate. The top surface wherein: (a) lines are below of layer'; (b) above layer; (c) some layer.
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