UV-curable compositions and method of use thereof in microelectronics

摘要: Radiation-curable compositions are provided for use in the fabrication of electronic components as passivation coatings; defect repair ceramic and thin film products by micropassivation high circuit density modules to allow product recovery; a solder mask assembly processes; protective coatings on printed board (PCB) circuitry devices against mechanical damage corrosion from exposure environment. The solvent-free, radiation-curable, preferably uv-curable, containing polymer binder, which is pre-formed thermoplastic or elastomeric polymer/oligomer, monofunctional and/or bifunctional acrylic monomer, multifunctional (more than 2 reactive groups) acrylated/methacrylated photoinitiator, where all constituents mutually miscible forming homogeneous viscous blend without addition an organic solvent. may also contain inorganic fillers nanoparticle fillers.