A high strength and high electrical conductivity bulk CuCrZr alloy with nanotwins

作者: L.X. Sun , N.R. Tao , K. Lu

DOI: 10.1016/J.SCRIPTAMAT.2014.11.032

关键词: Electrical resistivity and conductivityInternational Annealed Copper StandardLiquid nitrogenMicrostructureCopperDeformation (engineering)Ultimate tensile strengthMetallurgyMaterials scienceAlloy

摘要: A bulk nanostructured CuCrZr alloy consisting of nanotwins and nanograins was prepared … Standard are obtained in the nanostructured CuCrZr alloys processed by means of this one-…

参考文章(18)
Donna Sue Plickert, Nikki D. Wheaton, Kathleen Mills, Hugh Baker, Alloy phase diagrams ASM International. ,(1992)
K. Lu, N. R. Tao, Dynamic Plastic Deformation (DPD): A Novel Technique for Synthesizing Bulk Nanostructured Metals Journal of Materials Science & Technology. ,vol. 23, pp. 771- 774 ,(2009)
Ruslan Z. Valiev, Terence G. Langdon, Principles of equal-channel angular pressing as a processing tool for grain refinement Progress in Materials Science. ,vol. 51, pp. 881- 981 ,(2006) , 10.1016/J.PMATSCI.2006.02.003
Ruslan Z. Valiev, Structure and mechanical properties of ultrafine-grained metals Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. pp. 59- 66 ,(1997) , 10.1016/S0921-5093(97)00183-4
Juan-hua Su, Qi-ming Dong, Ping Liu, He-jun Li, Bu-xi Kang, Research on aging precipitation in a Cu–Cr–Zr–Mg alloy Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 392, pp. 422- 426 ,(2005) , 10.1016/J.MSEA.2004.09.041
C. R. Das, S. K. Albert, A. K. Bhaduri, R. Nithya, Effects of dilution on microstructure and wear behaviour of NiCr hardface deposits Materials Science and Technology. ,vol. 23, pp. 771- 779 ,(2007) , 10.1179/174328407X185802
Kun Xia Wei, Wei Wei, Fei Wang, Qing Bo Du, Igor V. Alexandrov, Jing Hu, Microstructure, mechanical properties and electrical conductivity of industrial Cu-0.5%Cr alloy processed by severe plastic deformation Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 528, pp. 1478- 1484 ,(2011) , 10.1016/J.MSEA.2010.10.059
K. Han ¶, R. P. Walsh, A. Ishmaku, V. Toplosky, L. Brandao, J. D. Embury, High strength and high electrical conductivity bulk Cu Philosophical Magazine. ,vol. 84, pp. 3705- 3716 ,(2004) , 10.1080/14786430412331293496