Electronic modules having grounded electromagnetic shields

作者: Stephen Parker , Thomas Scott Morris , Brian D. Sawyer , Donald Joseph Leahy

DOI:

关键词: EngineeringSubstrate (printing)Electromagnetic shieldingShieldsShielded cableElectronic modulesOptoelectronicsStructural engineering

摘要: In one embodiment, a meta-module having circuitry for two or more modules is formed on substrate, which preferably laminated substrate. The the different initially single meta-module. Each module will have component areas in formed. A metallic structure substrate each area to be shielded. body, such as an overmold then over all of At least portion shielded exposed through body by cutting, drilling, like operation. Next, electromagnetic shield material applied exterior surface and contact with structures.