Design and Analysis of InP-Based Waveguide Uni-Traveling Carrier Photodiode Integrated on Silicon-on-Insulator Through $\hbox{Al}_{2}\hbox{O}_{3}$ Bonding Layer
作者: B. Gao , H. Wang , C. Y. Liu , Q. Q. Meng , Y. Tian
R. Jones, H. D. Park, A. W. Fang, J. E. Bowers, O. Cohen, O. Raday, M. J. Paniccia, Hybrid silicon integrationJournal of Materials Science: Materials in Electronics. ,vol. 20, pp. 3- 9 ,(2009) , 10.1007/S10854-007-9418-Y