Ultra-compact image sensor assembly for thin profile devices

摘要: This document describes techniques and apparatuses that implement an ultra-compact image sensor assembly. In some embodiments, a printed circuit board assembly comprises multilayer (PCB) having asymmetric core structure. A cavity extends from exterior layer of the PCB to exposed portion interior PCB. The can be formed on structure or another above An is mounted at least partially in electrically connected conductive pads embodied By mounting cavity, height planar dimensions reduced, thereby enabling thinner profile imaging devices.