Multi-sublayer dielectric layers
作者： Yung Sheng Liu , Herbert Stanley Cole
DOI:
关键词: Interconnection 、 Electronic engineering 、 Dielectric layer 、 Dielectric 、 Composite material 、 Adhesion 、 Materials science 、 Laser drilling
摘要: A dielectric layer comprising a plurality of sublayers alternating composition can provide reduced constant while providing the adhesion and laser drilling properties higher material. Such multi-sublayer layers may be formed in situ on high density interconnect structure or laminated thereon after their own formation.
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