作者: Jung-Sik Kim , Kyle Jiang , Isaac Chang
DOI: 10.1088/0960-1317/16/1/007
关键词: Adhesive 、 Powder metallurgy 、 Composite material 、 Epoxy 、 Microelectromechanical systems 、 Photoresist 、 Sintering 、 Alloy 、 Fabrication 、 Materials science
摘要: This paper presents a new fabrication process for producing micro Al-based alloy components. The is based on powder injection moulding technology, while the micromoulds are produced using MEMS technology. involves (1) of PDMS from SU-8 masters, which UV photolithography process; (2) making metallic paste by mixing 80 wt% ultrafine Al (2.5 µm in average) powder, 5 Cu nanopowder (less than 60 nm), and 15 adhesive binder about 30 ml acetone; (3) mould filling with demoulding; (4) sintering moulded component an Ar atmosphere. proposed has been used to sinter Al–Cu microcomponents successfully without help either high pressure compression or Mg powder. research proposes approach fabricate 3D components meet needs applications where metal, rather silicon, required.