Mechanical properties of Bi x Sb 2 x Te 3 nanostructured thermoelectric material
作者： G Li , K R Gadelrab , T Souier , P L Potapov , G Chen
DOI: 10.1088/0957-4484/23/6/065703
关键词: Modulus 、 Materials science 、 Thermoelectric effect 、 Reliability (semiconductor) 、 Nanoindentation 、 Microstructure 、 Thermoelectric materials 、 Finite element method 、 Composite material 、 Nanostructure
摘要: Research on thermoelectric (TE) materials has been focused on their transport properties in order to maximize their overall performance. Mechanical properties, which are crucial for system reliability, are often overlooked. The recent development of a new class of high-performance, low-dimension thermoelectric materials calls for a better understanding of their mechanical behavior to achieve the desired system reliability. In the present study we investigate the mechanical behavior of nanostructure bulk TE material p-type Bi x Sb 2− x Te …
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