Experimental and Numerical Investigation of Ductile Regime Machining of Silicon Nitride

摘要: Recent research has shown that many semiconductor and ceramic materials can be machined in ductile fashion under very high pressures at low depths of cut. In a previous study, the authors reported results from numerical simulations orthogonal machining Silicon Nitride using pressure‐independent material model with von Mises yield criterion. Experimental evidence strongly suggests brittle‐to‐ductile transition is pressure‐dependent. Specifically, experiments indicate regime possible when hydrostatic pressure within workpiece same order magnitude as hardness. present work, behavior studied by carrying out single point diamond turning operation on samples cut ranging 250nm to 10μm. Force surface roughness data collected tests are presented. Chip morphology also investigated determine depth which brittle‐ductile takes place. Concurrently, process simulated commercial software AdvantEdge pressure‐sensitive Drucker‐Prager Numerical performed for 1μm 40μm different rake angles. Results micro‐ submicron‐depths cuts discussed.