作者: Gerald K. Hein , Timothy Ecklund , Jerry J. Bennett , Ian Olson
DOI:
关键词: Thermal energy 、 Thermal reservoir 、 Mechanics 、 Junction temperature 、 Electronic component 、 Heat sink 、 Materials science 、 Operating temperature 、 Thermodynamics 、 Heat pipe 、 Heat capacity rate
摘要: According to various embodiments, an electronic component, such as a processor, is thermally coupled heat sink via pipe. The pipe may contain working fluid configured freeze below threshold temperature corresponding the minimum operating of component. Accordingly, if component and/or temperature, then freezes, decreasing amount thermal energy transferred from sink. self-heat until it at least above temperature. Above in phase and increases pipe, thereby reducing