Systems and Methods for Extending Operating Temperatures of Electronic Components

作者: Gerald K. Hein , Timothy Ecklund , Jerry J. Bennett , Ian Olson

DOI:

关键词: Thermal energyThermal reservoirMechanicsJunction temperatureElectronic componentHeat sinkMaterials scienceOperating temperatureThermodynamicsHeat pipeHeat capacity rate

摘要: According to various embodiments, an electronic component, such as a processor, is thermally coupled heat sink via pipe. The pipe may contain working fluid configured freeze below threshold temperature corresponding the minimum operating of component. Accordingly, if component and/or temperature, then freezes, decreasing amount thermal energy transferred from sink. self-heat until it at least above temperature. Above in phase and increases pipe, thereby reducing

参考文章(11)
Adoniram C Hiebert, Thermal control structure ,(1967)
George P. Walchuk, Walter Weissman, Randall David Partridge, Sanjay K. Bhatia, Ramesh Gupta, Heat pipe for heating of gasoline for on-board ocane sgregation ,(2005)
Praveen Medis, Frank M. Gerner, Srinivas Parimi, Ahmed Shuja, H. Thurman Henderson, Semiconductor-based porous structure enabled by capillary force ,(2007)
Mark Henry Bonwick, Mark J. Owens, Chia Seiler, Quentin Scott, Robert Goh, Ross Halgren, Brian Robert Brown, WDM add/drop multiplexer module ,(2002)